TOKYO, September 11, 2025 - Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new compact version of its DIPIPM power semiconductor modules specifically for use in consumer and industrial equipment such as packaged air conditioners and heat pump heating and hot water systems. The new Compact DIPIPM series of products comprises the PSS30SF1F6 (rated current 30A / rated voltage 600V) and the PSS50SF1F6 (rated current 50A / rated voltage 600V), and samples will begin shipping on September 22.

By utilizing reverse-conducting insulated-gate bipolar transistors (RC-IGBTs),^* the module’s footprint has been reduced to almost 53% of that of the company’s conventional Mini DIPIPM Ver.7 series of products, enabling more compact inverter substrates in packaged air conditioners and other applications. The new products will be exhibited at Power Conversion and Intelligent Motion (PCIM) Asia Shanghai 2025 in Shanghai, China, from September 24 to 26.

Power semiconductors are key devices that efficiently convert electricity from DC to AC, and demand for them has accordingly been rising in recent years. Power semiconductor modules for packaged air conditioners and heat pump heating and hot water systems are used in the power conversion equipment of inverters that control outdoor unit compressors and fans. Globally, the shift to inverters is gathering pace in order to achieve energy savings in air conditioning systems, contributing to the realization of a decarbonized society. In this context, there is a growing need for more compact outdoor packaged air conditioner and heat pump components, not only to improve performance but also to reduce their footprint, leading to demand for smaller components such as inverter substrates.

In 1997 Mitsubishi Electric commercialized the DIPIPM intelligent power semiconductor module with a transfer mold structure; this integrated switching elements and the control ICs that drove and protected them. These have since been widely adopted in inverters for air conditioners, washing machines, heating and hot water systems, and industrial motors, helping to achieve a more compact inverter design and improved energy efficiency. The footprint of the company’s new Compact DIPIPM series of power semiconductor modules for consumer and industrial equipment has been reduced by approximately 47% compared to conventional products.

Through the adoption of RC-IGBTs, Mitsubishi Electric has achieved a smaller module size, contributing to the compact design of inverter substrates. Additionally, the new interlock function for arm short-circuit protection simplifies its design. The insulation distance from the terminals to the heat sink^** is equivalent to that of conventional products, making replacement easy. Furthermore, in response to the growing demand for heat pump air conditioning systems in regions with cold winters such as North America and Northern Europe, Mitsubishi Electric has developed a power semiconductor module that operates stably at low temperatures, achieving a continuous operating temperature lower limit of -40°C. This is boosting widespread adoption of inverter-equipped air conditioning systems in cooler regions and helping to achieve carbon neutrality.